System-on-System(SoS) Architecture for Secure Bio-medical Imaging

This paper presents an integrated approach towards implementation of a multilayered architecture based upon stacked silicon for image capture and secure data transmission suitable for bio-medical devices and implementation within patient-point-of-care network. The system architecture is comprised of a CMOS based image sensor layer, memory layer, 3D-DWT (Three-dimensional Discrete Wavelet Transform), 3D-AES (Three-dimensional Advanced Encryption Standard) and RF transmitter. Each layer is independent that can be fabricated using a different technology. Chips are stacked and interconnected using Through Silicon Via (TSV) technology. The CMOS image sensor located in the top layer operates as a high definition (HD) imager. The 3D-DWT compresses the stored image prior to processing. Compressed image data is encrypted, using 3D-AES encryption layer. The 3D-AES encryption block employs 3 functional layers: key schedule, Sbox and round processing. The round processors are designed as fully pipeline structures. The encrypted data is shuffled to employ fault tolerance. Encrypted and shuffled data is stored in memory or alternatively is transmitted through an RF transmitter. Since each system is interconnected through TSV, the number of the input and output buffers are reduced thereby reducing the power consumption. The system can be implemented as a core element of portable devices for transmission of images within a health care management system.